# Line below added 29 Nov 2024
GS0 | G593-SD0 - 5U

GS0 | G593-SD0-5UHPC Server - 4th Gen Intel® Xeon® - 5U DP SXM5 H100 8-GPU Server System | Application: AI , AI Training , AI Inference & HPCAccelerating Artificial Intelligence and Leading EfficiencyEngineering ri

GS0 | G593-SD0-5U

HPC Server - 4th Gen Intel® Xeon® - 5U DP SXM5 H100 8-GPU Server System | Application: AI , AI Training , AI Inference & HPC

Accelerating Artificial Intelligence and Leading Efficiency

Engineering richer features in a revolutionary platform, Intel has made an incredible jump in processor performance in the business transformation journey. AI and deep learning performance will benefit from the built-in AI acceleration engines, while networking, storage, and analytics leverage other specialized accelerators in the 4th Gen Intel Xeon Scalable processor.

Adding a host of new features to target a wide range of workloads, the new family of Xeon processors will deliver even better CPU performance and performance per watt and do so on a PCIe 5.0 platform with 2x the prior gen throughput to greatly speed up data movement to and from GPUs and storage.


Intel also created the Intel Xeon CPU Max Series with High Bandwidth Memory (HBM) for improvements in memory bound HPC and AI workloads. For this new platform, GIGABYTE has products ready to get the most out of Xeon CPU-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory.

Redefine Performance with 4th Gen Intel® Xeon® Scalable Processors



G593-SD0 Block Diagram



High Performance

Supports NVIDIA HGX™ H100 8-GPU

The NVIDIA H100 Tensor Core GPU enables an order-of-magnitude leap for large-scale AI and HPC with unprecedented performance, scalability and security for every data center. With NVIDIA AI Enterprise for streamlined AI development and deployment, NVIDIA NVLINK Switch System direct communication between up to 256 GPUs, H100 accelerates everything from exascale scale workloads with a dedicated Transformer Engine for trillion parameter language models, down to right-sized Multi-Instance GPU (MIG) partitions.


Power Efficiency

Automatic Fan Speed Control

Enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.


High Availability

Smart Ride Through (SmaRT)    

To prevent server downtime and data loss as a result of loss of AC power, we implement SmaRT in all server platforms. When such an event occurs, the system will throttle while maintaining availability and reducing power load. Capacitors within the power supply can supply power for 10-20ms, which is enough time to transition to a backup power source for continued operation.

Dual ROM Architecture   

If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

Hardware Security

Optional TPM 2.0 Module   

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

User Friendly

Tool-less Drive Bays Design

Clipping mechanism secures the drive in place. Install or replace a new drive in seconds.


Certified Ready with Software Partners

Being a member of key software alliance partner programs enables us to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.


Dimensions (WxHxD, mm)

5U

447 x 222.25 x 945

Motherboard

MSB3-G40

CPU

4th Generation Intel® Xeon® Scalable Processors

Intel® Xeon® CPU Max Series

Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor

Dual processor, CPU TDP up to 350W

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

2 x LGA 4677

Socket E

Chipset

Intel® C741 Chipset

Memory

32 x DIMM slots

DDR5 memory supported only

8-Channel memory per processor architecture

RDIMM modules up to 128GB supported

3DS RDIMM modules up to 256GB supported

Memory speed: Up to 4800 MHz (1DPC), 4400 MHz (2DPC)

LAN

Front side:

2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)

NCSI function supported

1 x 10/100/1000 management LAN

Video

Integrated in Aspeed® AST2600

2D Video Graphic Adapter with PCIe bus interface

1920x1200@60Hz 32bpp, DDR4 SDRAM

Storage

Front side:

8 x 2.5" Gen5 NVMe/SATA/SAS hot-swappable bays, from PEX89104

SAS card is required for SAS devices support

SAS

Depends on SAS Add-on card

RAID

Intel® SATA RAID 0/1/10/5

Expansion Slots

Supports NVIDIA HGX™ H100 with 8 x SXM5 GPUs

8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104

2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0

2 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1

1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0

Internal I/O

1 x TPM header

1 x VROC connector

1 x Front panel header

Front I/O

2 x USB 3.2 Gen1

1 x VGA

2 x RJ45

1 x MLAN (default port)

1 x Power button with LED

1 x ID button with LED

1 x Reset button

1 x NMI button

1 x System status LED

1 x HDD access LED

Rear I/O

1 x MLAN

Backplane I/O

Speed and bandwidth:

PCIe Gen5 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface

Optional TPM2.0 kit: CTM010

Power Supply

4+2 3000W (240V) 80 PLUS Titanium redundant power supplies

AC Input:

- 115-127V~/ 14.2A, 50-60Hz

- 200-220V~/ 15.8A, 50-60Hz

- 220-240V~/ 14.9A, 50-60Hz

DC Input:

- 240Vdc/ 14A

DC Output:

Max 1450W at 115-127V~

+54V/ 26.6A

+12Vsb/ 3A

Max 2900W at 200-220V~

+54V/ 53.4A

+12Vsb/ 3A

Max 3000W at 220-240V~ or 240Vdc

+54V/ 55.6A

+12Vsb/ 3A

NOTE: The system power supply requires C19 power cord

System Management

Aspeed® AST2600 management controller

GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard

HTML5 KVM

Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)

Sensor Reading History Data

FRU Information

SEL Log in Linear Storage / Circular Storage Policy

Hardware Inventory

Fan Profile

System Firewall

Power Consumption

Power Control

LDAP / AD / RADIUS Support

Backup & Restore Configuration

Remote BIOS/BMC/CPLD Update

Event Log Filter

User Management

Media Redirection Settings

PAM Order Settings

SSL Settings

SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

Front: 5 x 80x80x80mm (17,200rpm), 6 x 60x60x76mm (21,700rpm)

Rear: 6 x 80x80x80mm (17,000rpm), 3 x 40x40x56mm (29,700rpm)

Internal: 6 x 40x40x28mm (25,000rpm)/4 x 60x60x56mm (24,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C

Operating humidity: 8%-80% (non-condensing)

Non-operating temperature: -40°C to 60°C

Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

N/A

Packaging Content

1 x G593-SD0

2 x CPU heatsinks

6 x Carrier clips

1 x Rail kit

Part Numbers

- System with NVIDIA module: 6NG593SD0DR000AAX1*

- Motherboard: 9MSB3G40NR-000

- Rail kit: 25HB2-A96102-K0R

- CPU heatsink: 25ST1-24320H-M1R

- Backplane board: 9CBPG680NR-00

- Fan module 80x80x80mm: 25ST2-808037-S1R/25ST2-888032-S1R

- Fan module 60x60x76mm: 25ST2-667630-S1R

- Fan module 60x60x56mm: 25ST2-665620-S1R

- Fan module 40x40x56mm: 25ST2-40562G-A0R

- Fan module 40x40x28mm: 25ST2-44282D-D0R

- Power supply: 25EP0-23000A-D0S

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)

- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)

CATALOGUE 1
Title Version Date Size
HS Product Catalog

GS0 | G593-SD0 - 5U

GPU AI Machine Learning Server

  • Supports NVIDIA HGX™ H100 with 8 x SXM5 GPUs
  • Supports NVIDIA® NVLink® and NVSwitch™ technology
  • Up to 900GB/s GPU to GPU interconnection
  • 4th Gen Intel® Xeon® Scalable Processors
  • Intel® Xeon® CPU Max Series
  • Dual processor, LGA 4677
  • 8-Channel RDIMM DDR5 per processor, 32 x DIMMs
  • Dual ROM Architecture supported
  • 2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
  • 1 x dedicated management port
  • 8 x 2.5" Gen5 NVMe/SATA hot-swappable bays
  • 12 x LP PCIe Gen5 x16 slots
  • 1 x LP PCIe Gen4 x16 slot
  • 4+2 3000W (240V) 80 PLUS Titanium redundant power supplies


  • $USD $19,300.00

    *RRP Pricing*

    To View Channel Discounts Please Login


System Configurator


Tags: GS0 | G593-SD0 - 5U, 4th Gen Intel® Xeon Scalable processor sapphire rapids CPU, PCIe 5.0, GPU, HPC Server, AI, NVIDIA, GPU