AUS site
GS7|G894-SD3-AAX7
HPC/AI Server - 6th Gen Intel® Xeon® - 8U DP NVIDIA HGX™ B300
# AI # AI Training # AI Inference # HPC
Boosting Individual Applications with On-Point Features
Intel® Xeon® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.
Core Technology Aligned with Aspirations
GX5 | G893-SD1-AAX5 Product Overview
GS7|G894-SD3-AAX7 Block Diagram
High Performance
Supports NVIDIA HGX™ B300
NVIDIA HGX™ B300 is built for the age of AI reasoning with enhanced compute and increased memory. Featuring 7X more AI compute than Hopper platforms, 2.3TB of HBM3E memory, and high-performance networking integration with NVIDIA® ConnectX®-8 SuperNICs, Blackwell Ultra delivers breakthrough performance on the most complex workloads from agentic systems and reasoning to real time video generation for every data center.
Power Efficiency
Automatic Fan Speed Control
Enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.
High Availability
Smart Ride Through (SmaRT) 
To prevent server downtime and data loss as a result of loss of AC power, we implement SmaRT in all server platforms. When such an event occurs, the system will throttle while maintaining availability and reducing power load. Capacitors within the power supply can supply power for 10-20ms, which is enough time to transition to a backup power source for continued operation.
Dual ROM Architecture 
If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.
Hardware Security
Optional TPM 2.0 Module 
For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.
User Friendly
Tool-less Drive Bays Design
Clipping mechanism secures the drive in place. Install or replace a new drive in seconds.
Certified Ready with Software Partners
Being a member of key software alliance partner programs enables us to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.
Dimensions (WxHxD, mm)
8U
447 x 351 x 923
Motherboard
MSB4-PE2
CPU
Intel® Xeon® 6 Processors
- Intel® Xeon® 6700-Series Processors
- Intel® Xeon® 6500-Series Processors
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4710
Socket E2
Chipset
System on Chip
Memory
32 x DIMM slots
Support DDR5 RDIMM/MRDIMM [1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s
[1] MRDIMMs are only supported with Intel® Xeon® 6 Processors with P-cores and in a 1DPC configuration.
LAN
Front (I/O board - CFPG440):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear:
8 x 800 Gb/s OSFP InfiniBand XDR / Dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in ASPEED® AST2600
- 1 x VGA port
Storage
Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89072)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1
Modular GPU
NVIDIA HGX™ B300 with 8 x SXM GPUs
PCIe Expansion Slots
4 x FHHL x16 (Gen5 x16), from PEX89072
Front I/O
I/O board - CFPG440:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
8 x OSFP ports
MLAN board - CDB66:
1 x MLAN port
Security Modules
1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012
Power Supply[#1]
12 x 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
System Fans
Motherboard:
2 x 60x60x56mm / 4 x 60x60x76mm
OSFP ports:
4 x 40x40x56mm
PCIe slots:
2 x 80x80x56mm
GPU tray:
15 x 80x80x80mm
Operating Properties
Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Packaging Dimensions
1200 x 800 x 620 mm
Packaging Content
1 x G894-SD3-AAX7
2 x CPU heatsinks
4 x Carriers
1 x L-shape Rail kit
Part Numbers
- Barebone with NVIDIA module: 6NG894SD3DR000AAX7*
- Motherboard: 9MSB4PE2UR-000*
- L-shape Rail kit: 25HB2-UM6100-K0R
| Title | Version | Date | Size | |
|---|---|---|---|---|
| Product Catalog |  |
GS7|G894-SD3-AAX7
- NVIDIA HGX™ B300
- 8 x 800 Gb/s OSFP InfiniBand XDR / Dual 400 Gb/s Ethernet GPU networking ports
- via onboard NVIDIA ConnectX®-8 SuperNIC™
- 1.8TB/s GPU-to-GPU bandwidth with NVIDIA NVLink™ and NVSwitch™
- Dual Intel® Xeon® 6700/6500-Series Processors
- 8-Channel DDR5 RDIMM / MRDIMM, 32 x DIMMs
- Dual ROM Architecture
- Compatible with NVIDIA® BlueField®-3 DPUs
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 2 x M.2 slots with PCIe Gen5 x4 and x2 interface
- 8 x 2.5" Gen5 NVMe hot-swap bays
- 4 x FHHL PCIe Gen5 x16 slots
- 12 x 3000W 80 PLUS Titanium redundant power supplies
-
$USD $85,000.00
*RRP Pricing*To View Channel Discounts Please Login
