Maximum GPU Density for Your AI Factories

- 72 GPUs in a single rack

- 6th Gen Intel® Xeon® Granite Rapids CPU

- NVIDIA HGX B300 8-GPU platform

The S8L is a premier rack-level AI powerhouse, purpose-built for the next generation of AI Factories.

By leveraging the NVIDIA MGX™ architecture and advanced liquid-cooling technology, the S8L unlocks the full potential of the NVIDIA Blackwell Ultra platform.

Its highly efficient, ultra-dense 3U design delivers an industry-leading density of up to 72 GPUs per MGX rack, providing a powerful foundation for exascale computing.

Pioneering Performance with Blackwell Ultra

The Power of Blackwell: Seamlessly supports the NVIDIA HGX™ B300 platform, powered by NVIDIA Blackwell Ultra GPUs. It is engineered to master the world’s most complex Generative AI workloads and Large Language Models (LLM).
800G Fabric with ConnectX-8: Features onboard ConnectX-8 to enable blazing-fast 800G East-West data transfer. This massive bandwidth is critical for building massive-scale GPU clusters, ensuring zero-bottleneck communication across the fabric.

Unmatched Compute Density

Optimized Space Efficiency: The S8L integrates the immense power of the HGX™ B300 into a compact 3U chassis, significantly reducing the physical data center footprint compared to traditional 8U or 10U air-cooled alternatives.
Extreme Rack-Level Scaling: Purpose-built for the NVIDIA MGX™ rack, the system accommodates up to 9 nodes per rack, achieving an optimal density of 72 GPUs.

Leveraging the NVIDIA MGX™ Ecosystem

Accelerate Time-to-Market: By adhering to NVIDIA MGX™ ecosystem, we ensure a stable and reliable supply of critical components-including the rack, power distribution, and cooling manifolds-drastically reducing time-to-market for large-scale deployments.
Serviceability & Standardized Compatibility: The S8L integrates seamlessly with the MGX ecosystem, providing superior serviceability and ensuring your infrastructure remains flexible to evolve with future AI hardware generations.

Processor

Processor Family

Intel® Xeon® 6 processors

Max. TDP Support

350W

Number of Processors

2 Processors

Form Factor

Dimensions

W x H x D (mm)

438 x 131.7 x 864.5 mm

Storage

Default Configuration

(8) hot-swappable E1.S PCIe Gen5 SSD

Memory

Total Slots

(32) DDR5 RDIMM up to 6,400 MHz, (16) MRDIMM up to 8,000 MHz

Expansion Slot

Default Configuration

(3) FHHL SW PCIe Gen5 x16 slots

Fan

(8) 6056 fans

Operating Environment

Operating temperature: 5°C to 35°C

Non-operating temperature: -40°C to 70°C

Operating relative humidity: 20% to 85%RH

Non-operating relative humidity: 10% to 95%RH

CATALOGUE 1

Title	Version	Date	Size
Product Catalog

S8L | D75L-3U B300

Up to 72 GPUs per MGX rack
Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP
3U chassis compatible with 19” MGX 1.1 rack
1400A busbar with power shelves and DC-SCM support
NVIDIA HGX B300 8-GPU platform with 5th Gen NVLink® delivering 1.8TB/s bandwidth
Up to 2.3TB of HBM3e GPU memory per system
8x NVIDIA ConnectX®-8 SuperNICs with up to 800Gb/s connectivity
Up to three NICs dedicated for North/South traffic