GZ3 | G593-ZD2 - 5U

GZ3 | G593-ZD2-5U HPC Server - 5U DP SXM5 H100 8-GPU Server System | Application: AI , AI Training , AI Inference & HPC Powering the Next Generation of Server Architecture and Energy Efficiency  The path to A

GZ3 | G593-ZD2-5U

HPC Server - 5U DP SXM5 H100 8-GPU Server System | Application: AI , AI Training , AI Inference & HPC

Powering the Next Generation of Server Architecture and Energy Efficiency 

The path to AMD's 5nm 'Zen 4' architecture was paved with many successful generations of EPYC innovations and chiplet designs, and AMD EPYC 9004 Series processors continue this progression. Adding a host of new features to target a wide range of workloads, the new family of EPYC processors will deliver even better CPU performance and performance per watt, and do so on a platform with 2x the throughput of PCIe 4.0 lanes that also has support for 50% more memory channels. For this new platform, GIGABYTE has products ready to get the most out of EPYC-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory.

Notable Firsts in the EPYC 9004 Series


GZ3 Product Overview 



G593-SD0 Block Diagram


High Performance

Supports NVIDIA HGX™ H100 8-GPU

The NVIDIA H100 Tensor Core GPU enables an order-of-magnitude leap for large-scale AI and HPC with unprecedented performance, scalability and security for every data center. With NVIDIA AI Enterprise for streamlined AI development and deployment, NVIDIA NVLINK Switch System direct communication between up to 256 GPUs, H100 accelerates everything from exascale scale workloads with a dedicated Transformer Engine for trillion parameter language models, down to right-sized Multi-Instance GPU (MIG) partitions.


Power Efficiency

Automatic Fan Speed Control

Enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.


High Availability

Smart Ride Through (SmaRT)    

To prevent server downtime and data loss as a result of loss of AC power, we implement SmaRT in all server platforms. When such an event occurs, the system will throttle while maintaining availability and reducing power load. Capacitors within the power supply can supply power for 10-20ms, which is enough time to transition to a backup power source for continued operation.

Smart Crises Management and Protection (SCMP)

SCMP is a feature which is deployed in servers with non-fully redundant PSU design. With SCMP, in the event of faulty PSU or overheated system, the system will force the CPU into an ultra-low power mode that reduces the power load, which prevents the system from unexpected shutdown and avoids component damage or data loss.


Dual ROM Architecture   

If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.

Hardware Security

Optional TPM 2.0 Module   

For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.

User Friendly

Tool-less Drive Bays Design

Clipping mechanism secures the drive in place. Install or replace a new drive in seconds.


Certified Ready with Software Partners

Being a member of key software alliance partner programs enables us to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.


Dimensions (WxHxD, mm)

5U

447 x 222.25 x 945

Motherboard

MZB3-G42

CPU

AMD EPYC™ 9004 series processor family

Dual processor, 5nm technology

Up to 96-core, 192 threads per processor

cTDP up to 400W

*9x74F CPUs supported up to 360W TDP. cTDP 400W can only be supported under specific conditions. Please contact our customer support for details.

NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

2 x LGA 6096

Socket SP5

Chipset

System on Chip

Memory

24 x DIMM slots

DDR5 memory supported only

12-Channel memory architecture per processor

RDIMM modules up to 128GB supported

3DS RDIMM modules up to 256GB supported

Memory speed: Up to 4800 MHz

LAN

Front side:

2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)

NCSI function supported

1 x 10/100/1000 management LAN

Video

Integrated in Aspeed® AST2600

2D Video Graphic Adapter with PCIe bus interface

1920x1200@60Hz 32bpp, DDR4 SDRAM

Storage

Front side:

8 x 2.5" Gen5 NVMe hot-swappable bays, from PEX89104

SAS

N/A

RAID

N/A

Expansion Slots

Supports NVIDIA HGX™ H100 with 8 x SXM5 GPUs

8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104

2 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_0

2 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_1

1 x M.2 slot:

- M-key

- PCIe Gen3 x1, from CPU_0

- Supports 2280/22110 cards

1 x M.2 slot:

- M-key

- PCIe Gen3 x4, from CPU_1

- Supports 2280/22110 cards

Internal I/O

1 x TPM header

1 x Front panel header

Front I/O

2 x USB 3.2 Gen1

1 x VGA

2 x RJ45

1 x MLAN (default port)

1 x Power button with LED

1 x ID button with LED

1 x Reset button

1 x NMI button

1 x System status LED

1 x HDD access LED

Rear I/O

1 x MLAN

Backplane I/O

Speed and bandwidth:

PCIe Gen5 x4

TPM

1 x TPM header with SPI interface

Optional TPM2.0 kit: CTM010

Power Supply

4+2 3000W (240V) 80 PLUS Titanium redundant power supplies

AC Input:

- 115-127V~/ 14.2A, 50-60Hz

- 200-220V~/ 15.8A, 50-60Hz

- 220-240V~/ 14.9A, 50-60Hz

DC Input:

- 240Vdc/ 14A

DC Output:

Max 1450W at 115-127V~

+54V/ 26.6A

+12Vsb/ 3A

Max 2900W at 200-220V~

+54V/ 53.4A

+12Vsb/ 3A

Max 3000W at 220-240V~ or 240Vdc

+54V/ 55.6A

+12Vsb/ 3A

NOTE: The system power supply requires C19 power cord

System Management

Aspeed® AST2600 management controller

GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard

HTML5 KVM

Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)

Sensor Reading History Data

FRU Information

SEL Log in Linear Storage / Circular Storage Policy

Hardware Inventory

Fan Profile

System Firewall

Power Consumption

Power Control

LDAP / AD / RADIUS Support

Backup & Restore Configuration

Remote BIOS/BMC/CPLD Update

Event Log Filter

User Management

Media Redirection Settings

PAM Order Settings

SSL Settings

SMTP Settings

OS Compatibility

Please refer to OS compatibility table in support page

System Fans

Front: 5 x 80x80x80mm (17,000rpm), 6 x 60x60x72mm (21,700rpm)

Rear: 6 x 80x80x80mm (17,000rpm), 2 x 40x40x56mm (29,700rpm)

Internal: 4 x 40x40x28mm (25,000rpm), 6 x 60x60x56mm (24,000rpm)

Operating Properties

Operating temperature: 10°C to 35°C

Operating humidity: 8%-80% (non-condensing)

Non-operating temperature: -40°C to 60°C

Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

N/A

Packaging Content

1 x G593-ZD2

2 x CPU fansinks

1 x Rail kit

Part Numbers

- System with NVIDIA module: 6NG593ZD2DR000AAX1*

- Motherboard: 9MZB3G42NR-000

- Rail kit: 25HB2-A96102-K0R

- CPU fansink: 25ST1-24320H-M1R (TBD)

- Backplane board: 9CBPG680NR-00

- Fan module 80x80x80mm: 25ST2-808037-S1R/25ST2-888021-S1R (TBD)

- Fan module 60x60x72mm: 25ST2-667630-S1R (TBD)

- Fan module 60x60x56mm: 25ST2-665620-S1R (TBD)

- Fan module 40x40x56mm: 25ST2-40562G-A0R (TBD)

- Fan module 40x40x28mm: 25ST2-44282D-D0R (TBD)

- Power supply: 25EP0-23000A-D0S

- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)

- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)

CATALOGUE 1
Title Version Date Size
HS Product Catalog

GZ3 | G593-ZD2 - 5U

GPU AI ML HPC Server

  • Supports NVIDIA HGX™ H100 with 8 x SXM5 GPUs
  • Supports NVIDIA® NVLink® and NVSwitch™ technology
  • Up to 900GB/s GPU to GPU interconnection
  • AMD EPYC™ 9004 series processor family
  • Dual processor, 5nm technology
  • 12-Channel RDIMM DDR5 per processor, 24 x DIMMs
  • Dual ROM Architecture supported
  • 2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
  • 1 x dedicated management port
  • 2 x M.2 slots with PCIe Gen3 x4 and x1 interface
  • 8 x 2.5" Gen5 NVMe hot-swappable bays
  • 4 x FHHL PCIe Gen5 x16 slots
  • 8 x LP PCIe Gen5 x16 slots
  • 4+2 3000W (240V) 80 PLUS Titanium redundant power supplies

  • $USD $19,300.00

    *RRP Pricing*

    To View Channel Discounts Please Login


System Configurator


Tags: GZ3, G593-ZD2, 5U, AMD EPYC™ 9004 series CPU, PCIe 5.0, GPU, HPC Server, AI, NVIDIA H100, GPU