The S2SP T1HC
- RAM - LR 2048GB (2400MHz)
- Performance - Intel CPU 2695v4 (144 Core)
- SSD - 4 x 960MB of HGST 12GB/s SSD for mixed use work loads
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S2SP Tier 1 Hybrid Compute
The Game-Changing Xeon Phi™ Server that Redefines HPC Infrastructure
S2S T1HC is designed to power highly parallel applications—such as machine learning, video recognition, and data mining—with incomparable power and cost performance (performance per watt per dollar).
Up to One Thousand Parallel Threads Running within 2U Chassis
The new Intel® Xeon Phi™ X200 processor can not only serve as the host CPU for system boot-up, but it also possess an unprecedented parallel architecture. Each processor contains up to 72 cores and each core is capable of working on 4 threads, the S2S T1HC can process up to 1,152 parallel threads as a 2U 4-Node system, making it ideal for highly parallel and vectored applications, such as machine learning, video recognition, and data mining.
Incredible Power and Cost Efficiency with the All-integrated Xeon Phi™ Processor Architecture
As a highly-integrated platform, S2S T1HC does not require an additional co-processor to scale-up the parallel computing performance. It can achieve the same Linpack performance while consuming around 24% less power, and around 18% less total-cost-of-ownership. That sums up to a 40% performance per watt per dollar increase comparing with the past processor+ co-processor architecture.
High Density and Easy Service 2U 4-node System
Inheriting QCT’s 2U 4-node chassis design, the S2S T1HC consistently delivers high serviceability and availability. Its modularized shared infrastructure—such as fan cage and the PDB cage—not only reduces cable routing complexity, but also enables faster, easier, and more efficient installation, part replacement, and upgrades.
Exascale with Integrated Intel® Omni-Path Fabric or Optional Infiniband Mezzanine
S2S T1HC offers infiniband mezzanine or integrated processor (with Intel® Omni-Path fabric) options for scaling-up cluster performance. The optional Intel® Omni-Path fabric-integrated processor provides a 100Gb/s low-latency connection directly from each CPU, enhancing scalability between node and system more efficiently.
W x H x D (inch)17.48 x 3.44 x 31.1W x H x D (mm)444 x 87.5 x 790
SSD: ULTRASTAR SS200 2.5in 15.0MM 1920GB SAS MLC CRYPTO-E (DWPD=1)SAS Card: Mezz 12Gbps LSISAS3008 8i RAID 0,1,1E,10 NA PCI-E X8 Gen 3 Quanta QS-3008-8i-IR 35S2BMA0000
(1) PCIe Gen3 x16 LP MD-2
(1) PCIe Gen3 x16OCP LAN mezzanine slot
(1) USB 2.0
(2) high efficiency hot-plug 1600W PSU, 80 Plus Platinum (only support 220VAC input)
(4) system fans
IPMI v2.0 Compliant, on board "KVM over IP" support
Operating temperature: 5°C to 35°C (41°F to 95°F)
Non-operating temperature: -40°C to 65°C (-40°F to 149°F)
Operating relative humidity: 20% to 85%RH.
Non-operating relative humidity: 40% to 90%RH
Processor Type8 x Intel Xeon E5-2695V4 18 CoreMax. TDP SupportKNL Processor sku: 215W
KNL-F Processor sku: 230W
Number of Processors1Internal InterconnectNA
Total Slots6CapacityUp to 192GB RDIMM
Up to 384GB LRDIMMMemory TypeSamsung 2400Mhz LR DDR4 DIMM 32GBMemory Size32GB, 16GB, 8GB RDIMM
64GB, 32GB LRDIMM
LOMProcessor without Intel® Omni-Path Fabric:
Multiple OCP 2.0 form factor mezzanine options
Dedicated 10/100 management port per node
Processor with Intel® Omni-Path Fabric:
Dual 100 Gb Intel® OmniPath Fabric module per node
Dedicated 10/100 management port per nodeOptional NIC (more options refer to the CCL)Please refer to the Compatible Components List for more informationNIC:Intel 82599Es HHHL 10Gb SFP+ 2 port X520-DA2PCI-E X 8 Gen 2 E10G42BTDAG1P5QCT Intel OCP Mezz 10Gb SFP+ 2 port Quanta ON 10GbE 82599ES PCI-E X 8 Gen 2 3JF03MA00D0
(6) SATA 6Gb/s ports
Optional Controller (more options refer to the CCL)Please refer to the Compatible Components List for more information
(1) PCIe M.2
(1) SATADOM or SATA M.2
Integrated AST2400 with 8MB DDR3 video memory
(2) USB 3.0 ports
(1) VGA port
(1) RS232 serial Port
(1) 1GbE RJ45 magement port